Large-Area High-Precision FO-PLP Bonder

FO-PLP Inspection Equipment

600mm Large-Area Panel-Level Package Evaluation Prototype. [Photo courtesy of NEPES Co., Ltd.]

KIMM held the "Next-Generation Semiconductor FO-PLP Technology Commercialization Performance Report" on Tuesday, the 26th, at Ruby Hall, El Tower in Seoul. Seog-Hyeon Ryu, President of the Korea Institute of Machinery and Materials (KIMM), is delivering a welcome speech.

KIMM, the Korea Semiconductor Research Association, Hanwha Precision Machinery Co., Ltd., Cressem Co., Ltd., and MTI Co., Ltd. signed a memorandum of understanding (MOU) for the commercialization of next-generation semiconductor FO-PLP technology on Tuesday, the 26th, at the Ruby Hall of EL Tower in Seoul. From left: Park Sung-kyun, CEO of MTI Co., Ltd.; Oh Sang-min, CEO of Cressem Co., Ltd.; Ryu Seog-hyun, President of KIMM; Park Young-min, Executive Director of Hanwha Precision Machinery Co., Ltd.; and Ahn Ki-hyun, Secretary General of the Korea Semiconductor Research Association.

The attendees of the "Next-Generation Semiconductor FO-PLP Technology Commercialization Performance Report" are posing for a group photo.

KIMM held the "Next-Generation Semiconductor FO-PLP Technology Commercialization Performance Report" on Tuesday, the 26th, at the Ruby Hall of EL Tower in Seoul. Dr. Jun-Yeob Song, a research fellow at KIMM, is presenting the progress of the technology development.